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DIY Flexible Circuit Board with Gold Finish Bendable PI Substrate for Robotics

Categories Rigid Flex PCB
Brand Name: Xingqiang
Model Number: As Per Customer's Model
Place Of Origin: China
Certification: ISO 9001 / RoHS /UL / IATF 16949 (automotive)
MOQ: Sample,1 Pc(5 Square Meters)
Price: Based on Gerber Files
Payment Terms: ,T/T,Western Union
Supply Ability: 100000㎡/Month
Delivery Time: NA
PCB Name: Hard and Soft Board
Min Hole Size: 0.1mm
Routing: +/-0.1mm
Copper Overall: 0.5-5oz
Pcba Service: Support
Docunment Format: Gerber,Pcb
Regular Layer: 1-30L or 30+
Pcb Standard: IPC-A-610 E Class II
Quote Requirement: Gerber File And Bom List
Board Finished: Sinking Gold,HASL,OSP
Pcb Test: Flying Probe Test, E-test, Etc.
Aperture Tolerance: PTH ±0.075, NTPH ±0.05
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  • Product Details
  • Company Profile

DIY Flexible Circuit Board with Gold Finish Bendable PI Substrate for Robotics

What we can do? :

We specialize in customized flexible printed circuit boards (FPCs) and rigid-flex PCBs, offering complete structural solutions from 2 layers to multiple layers. Our core advantages include: using highly flexible polyimide substrates, combined with high-end surface treatments such as electroless nickel immersion gold (ENIG), ensuring oxidation resistance and durability of solder joints; supporting small-batch rapid prototyping and large-scale mass production, providing highly reliable flexible interconnection solutions for consumer electronics, automotive electronics, industrial equipment, and other applications.



Our circuit board's advantages:

High DensityThe multilayer design allows for high component density, making it suitable for complex electronic systems.
ReliabilityThe combination of rigid and flexible sections enhances durability and reliability, especially in dynamic environments.
Thermal ManagementMultiple layers can be designed to improve heat dissipation and manage thermal performance.
SolderabilityThe tin-spray finish ensures good solderability and protects the copper traces from oxidation.



Difficulties in making rigid-flex PCBs:

1.Flexible Section Challenges Material fragility: Thin, flexible substrates require specialized handling (e.g., carrier boards for horizontal processing) to prevent damage or misalignment .
2.Chemical sensitivity: Polyimide materials are incompatible with strong alkalis, necessitating adjusted process parameters for desmearing and blackening .
3.Lamination stability: Flexible layers exhibit poor dimensional stability, requiring controlled lamination conditions and specialized padding materials (e.g.,polypropylene films) to ensure adhesion .
4. Rigid Section Challenges Stress management: Inconsistent glass fabric orientation and thermal stress during pressing can cause warping or delamination .
5.Dimensional control:Shrinkage/expansion variations in flexible materials demand pre-compensation in rigid section fabrication .
6.Via processing: Flexible layer window machining requires precise timing and parameter control to balance weld integrity and foldability .
7.Integration Challenges Layer alignment: Hybrid FPC/PCB production necessitates precise registration between flexible and rigid layers, often using OPE- punched tooling .
8.Quality control: High-value assemblies require 100% inspection due to complex process flows and low yield rates .
9.Process integration: Conflicting requirements between flexible (e.g., NOFLOW prepregs) and rigid (e.g., standard FR-4) materials complicate lamination and drilling .


Factory showcase


PCB Quality Testing



Certificates and Honors




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