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PI Material Flexible Printed Circuit Board Double Sides 2.0oz Copper Thickness

Categories Flexible Printed Circuit Boards
Brand Name: Jingxin
Model Number: JX18112757
Certification: UL,RoHS, CE
Place of Origin: China
MOQ: 1 pc
Price: Negotiable
Supply Ability: 100000pcs per day
Packaging Details: ESD package
Board Thickness: 0.11mm-0.5mm
Service: OEM / ODM
Soldermask: Yellow PI Film
Features 1: Gerber/PCB File Needed
Features 2: 100% E-test
Features 3: 3 Years Guarantee
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    PI Material Flexible Printed Circuit Board Double Sides 2.0oz Copper Thickness

    PI Material FPC double sides 2.0oz copper thickness flexible pcb

    Number of layers: 2 layers
    Material: FPC
    Board thickness: 1.6mm
    Surface plating: ENIG
    Min Trace: 3mil

    With 14+ years of experience exporting PCBs overseas, We understands the needs of your business and welcomes the opportunity to serve you.

    JINGXIN Company philosophy is simple- Deliver quality printed circuit boards on time.
    We are ISO 9001:2008 certified.
    Our dedication to building a quality product is the centerpiece of our business policy.
    We are committed to fulfilling our customers' on-going quality requirements through continuous improvements to all of our internal processes. Our quality management system ensures the highest operating standards at all levels.

    ItemMass productionSmall batch production
    Number of layersUP TO 18LUP TO L
    Laminate typeFR-4, halogen free, high TG(Shengyi, KB), Cem-3, PTFE, aluminum based, PTEE, Rogers or more.FR-4, Halogen free, High TG(Shengyi, KB), Cem-3, PTFE, Aluminum based, PTEE, Rogers or more.
    Maximum board size610mm*1100mm610mm*1100mm
    Board thickness0.1mm-7.00mm<0.1mm and >7.00mm
    Minimum line width/space3.5mil(0.0875mm)3mil(0.075mm)
    Minimum line gap+/-15%+/-10%
    Outer layer copper thickness35um-175um35um-210um
    Inner layer copper thickness12um-175um12um-210um
    Drilling hole size(Mechanical)0.15mm-6.5mm0.15mm-6.5mm
    Finished hole size (Mechanical)0.15mm-6.0mm0.15mm-6.0mm
    Board thickness hole size ratio14:116:1
    Board thickness tolerance(t=0.8mm)±8%±5%
    Board thickness tolerance(t<0.8mm)±10%±8%
    Min. grid line width4mil(12, 18, 35um), 6mil(70um)4mil(12, 18, 35um), 6mil(70um)
    Min. grid spacing6mil(12, 18, 35um), 8mil(70um)6mil(12, 18, 35um), 8mil(70um)
    Hole size tolerance(Mechanical)0.05-0.075mm0.05mm
    Hole position tolerance(Mechanical)0.005mm0.005mm
    Solder mask colorGreen, Blue, Black, White, Yellow, Red, Grey etc.Green, Blue, Black, White, Yellow, Red, Grey etc.
    Impedance control tolerance+/-10%+/-8%
    Min. distance between drilling to conductor(non-blind buried orifice)8mil(8L), 9mil(10L), 10mil(14L), 12mil(26L)6mil(8L), 7mil(10L), 8mil(14L), 12mil(26L)
    Min. Character width and height(35um base copper)Line width: 5mil
    Height: 27mil
    Line width: 5mil; height: 27mil
    Max. test voltage500V500V
    Max. test current200mA200mA

    Surface treatment
    Flash Gold0.025-0.075um0.025-0.5um
    Immersion Gold0.05-0.1um0.1-0.2um
    Sn/Pb HASL1-70um1-70um
    Lead-free HASL1-70um1-70um
    Immersion Silver0.08-0.3um0.08-0.3um
    Gold Finger0.375um>=1.75um
    Hard Gold Plating0.375um>=1.75um
    Immersion Sin0.8um
    V-Cut rest thickness tolerance±0.1mm±0.1mm

    Outline profile
    ChamferThe angle type of the chamfer30,45,60
    Plug via holeMax.size can be plugged0.6mm
    Largest NPTH hole size6.5mm>6.5mm
    Largest PTH hole size6.5mm>6.5mm
    Min. solder spacer ring0.05mm0.05mm
    Min. solder bridge width0.1mm0.1mm
    Drilling diameter0.15mm-0.6mm0.15mm-0.6mm
    Min. pad diameter with hole14mil( 0.15mm drilling)12mil( 0.1mm laser)
    Min. BGA pad diameter10mil8mil
    Chemical ENIG gold thickness0.025-0.1um(1-4U)0.025-0.1um
    Chemical ENIG nickel thickness3-5um(120-200U)3-5um
    Min. resistance testΩ5

    FPCB Picture

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