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MoCu15 Microelectronic Thermal Spreaders And Thermal Management Base Plate

Categories Hermetic Packages Electronics
Brand Name: JBNR
Model Number: 50MoCu,60MoCu,70MoCu,85MoCu
Place of Origin: CHINA
MOQ: Negotiation
Price: Negotiable
Payment Terms: L/C, , T/T, Western Union
Delivery Time: 25days
Packaging Details: as customer required
Material: Molybdenum copper
Density: 10
CTE: 6.8
TC: 160-180
Plating: Nickel and Gold
Application: RF and microwave amplifiers
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    MoCu15 Microelectronic Thermal Spreaders And Thermal Management Base Plate


    MoCu15 Microelectronic Thermal Spreaders And Thermal Management Base Plate


    Description:

    Mo-Cu heat sink material is a composite of molybdenum and copper,the Coefficient of thermal expansion (CTE) of molybdenum copper can be tailored by adjusting the composition, which is the same way with tungsten copper composites. MoCu is much lighter than tungsten cooper, which make it more suitable for aerospace usage.


    Advantages:

    High thermal conductivity since no sintering additives have been used

    Excellent hermeticity

    Relatively small density

    Stampable sheets available (Mo content no more than 75 wt%)

    Semi-finished or finished (Ni/Au plated) parts available


    Product Properties:

    GradeMo ContentDensity g/cm3

    Coefficient of thermal

    Expansion ×10-6 (20℃)

    Thermal conductivity W/(M·K)
    85MoCu85±2%10.07160(25℃)/156(100℃)
    70MoCu70±2%9.87200(25℃)/196(100℃)
    60MoCu60±2%9.667.5222(25℃)/217(100℃)
    50MoCu50±2%9.510.2250(25℃)/220(100℃)

    Application:

    These composite are widely used in applications such as IGBT modules,Optoelectronics Packages, Microwave Packages, C Packages, Laser Sub-mounts, etc.


    Product picture:

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