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Electric OEM/ODM Aluminum FR4 Printed Circuit Board With Laser Machining

Categories FR4 Printed Circuit Board
Brand Name: chao sheng
Model Number: electric products
Place of Origin: Shenzhen, Guangdong, China
MOQ: 1PCS
Price: Negotiation
Payment Terms: L/C, T/T, Western Union
Supply Ability: 5-200K/pcs per month
Delivery Time: 18-20day
Packaging Details: Anti-static bag + Anti-static bubble wrap + Good quality carton box
Certification: ISO/UL/RoHS/TS
Micro machining or not: Micro Machining
Cnc machining or not: CNC Machining
Type: Laser Machining
Material capabilities: Aluminum
Material: Aluminum
Product name: Clamp pcb test fixture manufacturer
Service: OEM/ODM availabe and welcome
Process: Cnc Machining+deburrs
Keyword: CNC Macining Parts,Prototyping Supplier Rapid Prototyping 2D&3D Drawing Design
Tolerance: 0.01mm
Name: PCB Instrument Box
Packing: Poly Bag + Inner Box + Carton
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    • Product Details
    • Company Profile

    Electric OEM/ODM Aluminum FR4 Printed Circuit Board With Laser Machining

    8-layer coil electric FR4 Printed Circuit Board with Laser Machining


    Product Description

    1. FR4 Printed Circuit Board Features:
    2. minimum hole 0.10mm, copper thickness 1OZ, line width line spacing 4/4mil, impedance Ω±10%, Resin plug hole + copper fill hole
    3. Product area: electric products
    4. Number of floors: 8 layers
    5. Plate thickness: 1.60mm
    6. Product structure: FR-4, TG150, inner and outer copper thickness 2OZ, impedance ±10%
    7. Solder mask green, immersion gold 2u"
    8. Vacuum Packaging + Moisture-proof Bead + Humidity Card + Cartonday

    FR4 Printed Circuit Board Application,PCB process production capability

    Process capability table
    Technical ltemMassProductAdvanced Technology
    201620172018
    Max.Layer Count26L36L80L

    Through-hole plate
    2~45L2~60L2~80L
    Max.PCBSize(in)24*52"25*62"25*78.75"
    The layer number of FPC1~36L1~50L1~60L
    Max.PCBSize(in)9.8"*196"9.8"*196"10"*196"Reel to reel
    Layeredplatelayer2~12L2~18L2~26L
    Max.PCBSize(in)9"*48"9"*52"9"*62"
    Combination of hard and soft layers3~26L3~30L3~50L
    HDI,Interconnect HDI5+X+5Interconnect HDI7+X+7Interconnect HDI8+X+8,Interconnect HDI
    HDI PCB4~45L4~60L4~80L
    HDI,Interconnect HDI3+20+34+X+4Interconnect HDI4+X+4,Interconnect HDI
    Max.PCBSize(in)24"*43"24"*49"25"*52"
    MaterialFR-4 RogersFR-4 RogersFR-4 Rogers
    Base materialHalogenfree,LowDKHalogenfree,LowDKHalogenfree,LowDK
    Build-up MaterialFR-4FR-4FR-4
    BOard,Thickness(mm)Min.12L(mm)0.430.42~8.0mm0.38~10.0mm
    Min.16L(mm)0.531.60~8.0mm0.45~10.0mm
    Min.18L(mm)0.632.0~8.00.51~10.0mm
    Min.52L(mm)0.82.50~8.0mm0.65~10.0mm
    MAX(mm)3.510.0mm10.0mm
    Min.CoreThickness um(mil)254"(10.0)254"(10.0)0.10~254(10.0mm)
    Min.Build up Dielectric38(1.5)32(1.3)25(1.0)
    BaseCopperWeightInner Layer4/1-8 OZ4/1-15 OZ4/1-0.30mm
    Out Layer4/1-10 OZ4/1-15 OZ4/1-30 OZ
    Gold thick1~40u"1~60u"1~120u"
    Nithick76~127u"76~200u"1~250u"
    Min.HOle/Land um(mil)150/300(6/12)100/200(4/8)100/200(4/8)

    Min.Laser via/landum(mil)
    60/170(2.4/6.8)50/150(2/6)50/150(2/6)

    Min. IVH,Hole size/landum(mil)
    150/300(6/12)100/200(4/8)100/200(4/8)
    DieletricThickness38(1.5)32(1.3)32(1.3)
    125(5)125(5)125(5)
    SKipviaYesYesYes
    viaoNhie(laserviaon BuriedPTH)YesYesYes
    Laser Hole FillingYesYesYes

    PCB, FPC main material supply

    NOsupplierSupply material nameMaterial origin
    1JapanHigh frequency materials, PI, covering membrane,Copper berthMitsubishi Japan
    2dupontHigh frequency materials, PI, covering film, dry film,Copper berthJapan
    3panasonicHigh frequency materials, PI, covering membrane,Copper berthJapan
    4SanTiePI, covering membraneJapan
    5Born goodFR-4,PI,PP,Copper berthshenzhen, China
    6A rainbowPI, covering membrane,Copper berthTaiwan
    7teflonHigh frequency materialsThe United States
    8RogersHigh frequency materialsThe United States
    9Nippon SteelPI, covering membrane,Copper berthTaiwan
    10sanyoPI, covering membrane,Copper berthJapan
    11South AsiaFR-4,PI,PP,Copper berthTaiwan
    12doosanFR-4,PPSouth Korea
    13Tai Yao plateFR-4,PP,Copper berthTaiwan
    14AlightFR-4,PP,Copper berthTaiwan
    15YaoguangFR-4,PP,Copper berthTaiwan
    16YalongFR-4,PPThe United States
    17ISOALFR-4,PPJapan
    18OAKBuried, buried resistance, PPJapan
    19United States 3MFR-4,PPThe United States
    20BergsCopper and aluminum matrixJapan
    21The suninkTaiwan
    22MuratainkJapan
    23generous andbenevolentPI, covering membrane,Copper berthChina's jiangxi
    24YasenPPI, covering membraneChina jiangsu
    25Yong Sheng TaiinkChina guangdong panyu
    26mitainkJapan
    27Transcriptceramic materialTaiwan
    28HOMEceramic materialJapan
    29Fe-Ni-MnAlloy Invar, Section SteelTaiwan

    Quality Assurance:
    Our Quality processes include:
    1. IQC: Incoming Quality Control (Incoming Materials Inspection)
    2. First Article Inspection for every process
    3. IPQC: In Process Quality Control
    4. QC: 100% Test & Inspection
    5. QA: Quality Assurance based on QC inspection again
    6. Workmanship: IPC-A-610, ESD
    7. Quality Management based on CQC, ISO9001:2008, ISO 14001:2004

    Certificates:
    ISO9001-2008
    ISO/TS16949
    UL
    IPC-A-600G and IPC-A-610E Class II compliance
    Customer's requirements


    Quick Detail:

    1. PCB Assembly on SMT and DIP

    2. PCB schematic drawing/ layout /producing

    3. PCBA clone/change board

    4. Components sourcing and purchasing for PCBA

    5. Enclosure design and plastic injection molding

    6. Full range of testing services. Including: AOI, Fuction Testing , In Circuit Testing, X-Ray For BGA Testing,

    7. IC programming


    Surface treatment: full board OSP, full board immersion gold, whole board electric nickel gold, electric gold + immersion gold, electric gold + OSP, OSP + immersion gold, OSP + carbon bridge, gold finger, OSP + gold finger, immersion gold + gold finger, Shen tin, immersion silver, lead-free tin spray


    PCB, FPC product application field

    Various digital products, automotive new energy, automotive products, military, aerospace, medical, wireless terminals, wired terminals, communication equipment, communication stations, finance, industrial industrial control, consumer electronics, educational equipment, smart devices, smart products, security, LED, computer, mobile phone and other electronic products


    FAQ:
    Q: What files do you use in PCB fabrication?
    A: Gerber or Eagle, BOM listing, PNP and Components Position
    Q: Is it possible you could offer sample?
    A: Yes, we can custom you sample to test before mass production
    Q: When will I get the quotation after sent Gerber, BOM and test procedure?
    A: Within 6 hours for PCB quotation and around 24-48 hours for PCBA quotation.
    Q: How can I know the process of my PCB production?
    A: 5-7days for PCB production and components purchasing, and 14 days for PCB assembly and Testing
    Q: How can I make sure the quality of my PCB?
    A: We ensure that each piece of PCB products work well before shipping. We'll test all of them according to your test procedure.

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