Sign In | Join Free | My webtextiles.com
webtextiles.com
Products
Search by Category
Home > Passive Components >

Minimum Hole 0.10mm Circuit Board Prototyping Service 8 Layers Level 2 HDI Durable

Categories FR4 Printed Circuit Board
Brand Name: China chao sheng
Model Number: cspcb1449
Certification: ISO/UL/RoHS/TS
Place of Origin: Shenzhen, Guangdong, China
MOQ: 1PCS
Price: USD1.80/pcs
Payment Terms: T/T, Western Union
Supply Ability: 5000000pcs per month
Delivery Time: 15-20day
Packaging Details: Anti-static bag + Anti-static bubble wrap + Good quality carton box
Application: Communication System Equipment
Material: FR-4, TG150 Halogen-free
Product Structure: 8 Layers Level 2 HDI​
Board Thickness: 1.60mm
Aspect Ratio: 1:1
Size: 129*126mm
Impedance Value: ± 10%
Provide PCB Information: Gberber, Production Requirements, MOQ Quantity
Surface Treatment: Immersion Gold, Electro-nickel Gold, Immersion Tin, OSP, Lead-free Spray Tin
E-Test: 100% Electrical Test Prior Shipment
  • Haven't found right suppliers
  • Our buyer assistants can help you find the most suitable, 100% reliable suppliers from China.
  • And this service is free of charge.
  • we have buyer assistants who speak English, French, Spanish......and we are ready to help you anytime!
  • Submit Buying Request
    • Product Details
    • Company Profile

    Minimum Hole 0.10mm Circuit Board Prototyping Service 8 Layers Level 2 HDI Durable

    8 layers Level 2 HDI​ Large Industrial communication PCB HDI FR-4, TG150 Halogen-free Thick copper + thick goldinner and outer copper ,HDI Printed Circuit Boards,prototype pcb fabrication

    Product Description

    1. Product area: Inductive drive products
    2. Number of layers: 8layers of second-order HDI,minimum hole 0.10mm, copper thickness 1OZ, line width line spacing 4/4mil, impedance Ω±10%, Resin plug hole + copper fill hole
    3. Plate thickness: 1.60mm
    4. Product structure: FR-4, TG150,Halogen-free inner and outer copper thickness 1OZ, impedance ±10%
    5. Solder mask green, immersion gold 15u"
    6. Quantities range from prototype to volume production.
    7. 100% E-Test
    8. Packaging: Vacuum Packaging + Moisture-proof Bead + Humidity Card + Carton
    9. LED: military, medical, laser, hole, optical and other LED small pitch PCB
      Product structure: 8ayers Level 2 HDI​
      Material: FR-4, TG150, halogen-free
      Board thickness: 1.60MM
      Size mm:
      Impedance value: ± 10%
      Minimum hole: 0.15mm
      Minimum line width and space:
      aspect ratio:
      Surface treatment: immersion gold, electro-nickel gold, immersion tin, OSP, lead-free spray tin
      Provide PCB information: Gberber, production requirements, MOQ quantity
      PCBA information: BOM report, X, Y left plot
    10. Printed circuit board (pcb) and PCBA products
      Communication terminal, communication station, electronic communication, optical fiber, optical module, communication equipment, communication instrument, computer, household appliance, testing equipment, testing instrument, instrument, SD card, SG card, mobile phone, computer, various antennas, cars, music Equipment, playback equipment, banking equipment, medical instruments, medical equipment, medical equipment, aerospace, aviation, military, LED, OLED, OLCD power control power supply, industrial power supply, communication power supply, automotive power supply, office equipment, digital products,computers,etc.Applications;
      Flexible circuit board (FPC) and FPCA product areas
      CD, hard disk, printer, fax machine, scanner, sensor, mobile phone, connector, module, walkie-talkie antenna card, high-end camera, digital camera, laser head, CD, medical, instrumentation, drive, automotive instrumentation, medical instrument, Medical equipment, banking equipment, industrial instruments, LED light bars, military, aviation, aerospace, defense and other high-tech products, of which more than 70% of the products are exported to Europe, America, Europe, Central Europe, Western Europe, Southeast Asia, Asia-Pacific and other countries and area.

    Our Service

    1. PCB Production Service.
    2. PCB FPC design Service.
    3. PCB Assembly Service. (SMT, BGA, DIP)
    4. PCBA Housing assembly serivce.
    5. PCBA Final Functional Testing.
    6. PCB PCBA Copy Service.
    7. Electronic Components Purchasing & BOM List Purchasing Services.
    8. PCB SMT Stencil. (Laser cut & Etching)
    9. Quality Assurance:
      Our Quality processes include:
      1. IQC: Incoming Quality Control (Incoming Materials Inspection)
      2. First Article Inspection for every process
      3. IPQC: In Process Quality Control
      4. QC: 100% Test & Inspection
      5. QA: Quality Assurance based on QC inspection again
      6. Workmanship: IPC-A-610, ESD
      7. Quality Management based on CQC, ISO9001:2008, ISO 14001:2004


      Certificates:
      ISO9001-2008
      ISO/TS16949
      UL
      IPC-A-600G and IPC-A-610E Class II compliance
      Customer's requirements


      Quick Detail:

      1. PCB Assembly on SMT and DIP

      2. PCB schematic drawing/ layout /producing

      3. PCBA clone/change board

      4. Components sourcing and purchasing for PCBA

      5. Enclosure design and plastic injection molding

      6. Full range of testing services. Including: AOI, Fuction Testing , In Circuit Testing, X-Ray For BGA Testing,

      7. IC programming


      PCB, FPC product application field
      Various digital products, automotive new energy, automotive products, military, aerospace, medical, wireless terminals, wired terminals, communication equipment, communication stations, finance, industrial industrial control, consumer electronics, educational equipment, smart devices, smart products, security, LED, computer, mobile phone and other electronic products


      FAQ:
      Q: What files do you use in PCB fabrication?
      A: Gerber or Eagle, BOM listing, X, Y sitting report, PNP and Components Position
      Q: Is it possible you could offer sample?
      A: Yes, we can custom you sample to test before mass production
      Q: When will I get the quotation after sent Gerber, BOM and test procedure?
      A: Within 6-48hours for PCB quotation and around 24-48 hours for PCBA quotation.
      Q: According to the difficulty of high-layer boards, How can I know the process of my PCB production?
      A: 7-35days for PCB production and components purchasing, and 14-20days for PCB assembly and Testing
      Q: How can I make sure the quality of my PCB?
      A: We ensure that each piece of PCB, PCBA products work well before shipping. We'll test all of them according to your test procedure.

    10. PCB, FPC process production capability

      Technical ltemMassProductAdvanced Technology
      201620172018
      Max.Layer Count26L36L80L
      Through-hole plate2~45L2~60L2~80L
      Max.PCBSize(in)24*52"25*62"25*78.75"
      The layer number of FPC1~36L1~50L1~60L
      Max.PCBSize(in)9.8"*196"9.8"*196"10"*196"Reel to reel
      Layeredplatelayer2~12L2~18L2~26L
      Max.PCBSize(in)9"*48"9"*52"9"*62"
      Combination of hard and soft layers3~26L3~30L3~50L
      Interconnect HDI5+X+5Interconnect HDI7+X+7Interconnect HDI8+X+8,Interconnect HDI
      HDI PCB4~45L4~60L4~80L
      Interconnect HDI3+20+34+X+4Interconnect HDI4+X+4,Interconnect HDI
      Max.PCBSize(in)24"*43"24"*49"25"*52"
      MaterialFR-4 RogersFR-4 RogersFR-4 Rogers
      Base materialHalogenfree,LowDKHalogenfree,LowDKHalogenfree,LowDK
      Build-up MaterialFR-4FR-4FR-4
      BOard,Thickness(mm)Min.12L(mm)0.430.42~8.0mm0.38~10.0mm
      Min.16L(mm)0.531.60~8.0mm0.45~10.0mm
      Min.18L(mm)0.632.0~8.00.51~10.0mm
      Min.52L(mm)0.82.50~8.0mm0.65~10.0mm
      MAX(mm)3.510.0mm10.0mm
      Min.CoreThickness um(mil)254"(10.0)254"(10.0)0.10~254(10.0mm)
      Min.Build up Dielectric38(1.5)32(1.3)25(1.0)
      BaseCopperWeightInner Layer4/1-8 OZ4/1-15 OZ4/1-0.30mm
      Out Layer4/1-10 OZ4/1-15 OZ4/1-30 OZ
      Gold thick1~40u"1~60u"1~120u"
      Nithick76~127u"76~200u"1~250u"
      Min.HOle/Land um(mil)150/300(6/12)100/200(4/8)100/200(4/8)
      Min.Laser via/landum(mil)60/170(2.4/6.8)50/150(2/6)50/150(2/6)
      Min. IVH,Hole size/landum(mil)150/300(6/12)100/200(4/8)100/200(4/8)
      DieletricThickness38(1.5)32(1.3)32(1.3)
      125(5)125(5)125(5)
      SKipviaYesYesYes
      viaoNhie(laserviaon BuriedPTH)YesYesYes
      Laser Hole FillingYesYesYes
      TechnicalltemMass ProductAdvanced Technolgy
      2017year2018year2019year
      Drill hole depth ratioThroughHole2017year.40:1.40:1
      Aspet RatioMicro Via.35:11.2:11.2:1
      Copper Filling Dimple Size um(Mil)10(0.4)10(0.4)10(0.4)
      Min.LineWidth&spacelnner Layer um(mil)45/45(1.8/1.8)38/38(1.5/1.5)38/38(1.5/1.5)
      Plated Layer um(mil)45/45(1.8/1.8)38/38(1.5/1.5)38/38(1.5/1.5)
      BGAPitch mm(Mil)0.30.30.3
      Min.PTH Hole ring um(mil)75(3mil)62.5(2.5mil)62.5(2.5mil)
      Line Width Control∠2.5MIL±0.50±0.50±0.50
      2.5Mil≤L/W∠4mil±0.50±0.50±0.50
      ≦3mil±0.60±0.60±0.60
      Laminated structureLayer by layer3+N+34+N+45+N+5
      Sequential Build-up20L Any Layer36L Any Layer52L Any Layer
      Multi-layer overlayN+NN+NN+N
      N+X+NN+X+NN+X+N
      sequential Lamination2+(N+X+N)+22+(N+X+N)+22+(N+X+N)+2
      Soft and hard bonding2+(N+X+N)+22+(N+X+N)+22+(N+X+N)+2
      PTH filling processPTH resin plug hole + plating fill
      Electroplated hole/copper plug hole
      PTH resin plug hole + plating fill
      Electroplated hole/copper plug hole
      PTH resin plug hole + plating fill
      Electroplated hole/copper plug hole
      18 layers of second-order HDI FR-4, TG170,+M6 inner and outer copper ,HDI Printed Circuit18 layers of second-order HDI FR-4, TG170,+M6 inner and outer copper ,HDI Printed Circuit
    Buy Minimum Hole 0.10mm Circuit Board Prototyping Service 8 Layers Level 2 HDI Durable at wholesale prices
    Send your message to this supplier
     
    *From:
    *To: Shenzhen Chaosheng Electronic Technology Co.,Ltd
    *Subject:
    *Message:
    Characters Remaining: (0/3000)
     
    Inquiry Cart 0